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    0.1 1 10 0.1 1 10 d ds a -i , drain-to-source current (a) -v , drain-to-source voltage (v) -3.0v vgs top - 15v - 10v - 7.0v - 5.5v - 4.5v - 4.0v - 3.5v bottom - 3.0v 20 s pulse width t = 150c j 0.1 1 10 3.0 4.0 5.0 6.0 7.0 8.0 t = 25c t = 150c j j gs d a -i , drain-to-source current (a) -v , gate-to-source voltage (v) v = -10v 20 s pulse width ds 0.0 0.5 1.0 1.5 2.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 j t , junction temperature (c) r , drain-to-source on resistance ds(on) (normalized) a v = -10v gs i = -0.60a d 0.1 1 10 0.1 1 10 d ds 20 s pulse width t = 25c a -i , drain-to-source current (a) -v , drain-to-source voltage (v) j -3.0v vgs top - 15v - 10v - 7.0v - 5.5v - 4.5v - 4.0v - 3.5v bottom - 3.0v downloaded from: http:///

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 $   %   %     0 20 40 60 80 100 120 140 1 10 100 c, capacitance (pf) a ds -v , drain-to-source voltage (v) v = 0v, f = 1mhz c = c + c , c shorted c = c c = c + c gs iss gs gd ds rss gd oss ds gd c iss c oss c rss 0 4 8 12 16 20 0.0 1.0 2.0 3.0 4.0 5.0 g gs a -v , gate-to-source voltage (v) q , total gate charge (nc) v = -24v v = -15v dsds for test circuit see figure 9 i = -0.60a d 0.1 1 10 0.4 0.6 0.8 1.0 1.2 1.4 1.6 t = 25c t = 150c j j v = 0v gs sd sd a -i , reverse drain current (a) -v , source-to-drain voltage (v) 0.1 1 10 1 10 100 operation in this area limited by r ds(on) t = 25c t = 150c single pulse a -i , drain current (a) -v , drain-to-source voltage (v) ds d aj 100 s 1ms 10ms downloaded from: http:///

www.irf.com 5  "# & '  ()*    $+ v ds 90%10% v gs t d(on) t r t d(off) t f  !      ! ,'      1 ! "#$ 0.1 % 2      2  k   -%  ,' q g q gs q gd v g charge  %      ./ d.u.t. v ds i d i g -3ma v gs .3 f 50k .2 f 12v current regulator same type as d.u.t. current sampling resistors + - + - 0.1 1 10 100 1000 0.00001 0.0001 0.001 0.01 0.1 1 10 100 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thja a p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thja 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) downloaded from: http:///

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  p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-appliedvoltage reverserecovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period + - + + + - - -    2    ? "0"+!!"832  ?   +!!"833*+aa ? k 0+k"    +(3 " ? ($.3"++  ? -" !  ? ($(1)"++    <&  0 20 !3<  >! llk  >!0<  >!6& 0   l 00 .
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www.irf.com 7 micro3 / sot-23 package marking a yw lc part number y = year w = week lot code halogen free indicator part number code reference: a = irlml2402 b =irlml2803 c = irlml2402 d = irlml5103 e = irlml6402 f = irlml6401 g = irlml2502 h = irlml5203 note: a line above the work week (as shown here) indicates lead-free micro3 (sot-23 / to-236ab) part marking informationnote: for the most current drawing please refer to ir website at http://www.irf.com/package a 2001 a 27 w = (1-26) if preceded by last digit of calendar year w = (27-52) if preceded by a letter y8 2008 3 2003 1 2001 ye ar 2002 2 5 2005 2004 4 2007 2006 7 6 2010 0 2009 9 ye ar y c 03 wor k we e k 0102 a wb 04 d 24 26 25 xz y wor k we e k w k h g f e d c b 2006 2003 2002 2005 2004 2008 2007 2010 2009 j y 51 29 2830 c bd 50 x 52 z 0.972 1.900 recommended footprint 0.802 0.950 2.742   !" #$ !#%#& '()* 

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  e e1 e d a b 0.15 [0.006] e1 1 2 3 m cba 5 6 6 5 3x l c b a1 3x a a2 abc m 0.20 [0.008] 0.10 [0.004] c c l2 h 4 l1 7 0.89 1.12 symbol max min a1 b 0.01 0.10 c 0.30 0.50 d 0.08 0.20 e 2.80 3.04 e1 2.10 2.64 e 1.20 1.40 a 0.95 bsc l 0.40 0.60 08 millimeters a2 0.88 1.02 e1 1.90 bsc ref 0.54 l1 bsc 0.25 l2  bsc  ref  
 
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dimensions notes: 1. dimensioning & tolerancing per ansi y14.5m-1994 2. dimensions are shown in millimeters [inches]. 3. controlling dimension: millimeter. 4. datum plane h is located at the mold parting line. 5. datum a and b to be determined at datum plane h. 6. dimensions d and e1 are measured at datum plane h. dimensions does not include mold protrusions or interlead flash. mold protrusions or interlead flash shall not exceed 0.25 mm [0.010 inch] per side. 7. dimension l is the lead length for soldering to a substrate. 8. outline conforms to jedec outline to-236 ab. downloaded from: http:///

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  2.05 ( .080 ) 1.95 ( .077 ) tr feed direction 4.1 ( .161 ) 3.9 ( .154 ) 1.6 ( .062 ) 1.5 ( .060 ) 1.85 ( .072 ) 1.65 ( .065 ) 3.55 ( .139 ) 3.45 ( .136 ) 1.1 ( .043 ) 0.9 ( .036 ) 4.1 ( .161 ) 3.9 ( .154 ) 0.35 ( .013 ) 0.25 ( .010 ) 8.3 ( .326 ) 7.9 ( .312 ) 1.32 ( .051 ) 1.12 ( .045 ) 9.90 ( .390 ) 8.40 ( .331 ) 178.00 ( 7.008 ) max. notes: 1. controlling dimension : millimeter. 2. outline conforms to eia-481 & eia-541. note: for the most current drawing please refer to ir website at http://www.irf.com/package data and specifications subject to change without notice. ir world headquarters: 101n.sepulveda blvd, el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . 12/2011 downloaded from: http:///


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